Eine Publikation der Swissprofessionalmedia AG
05.03.2019

EBV Elektronik, RoodMicrotech and Fraunhofer Institute for Integrated Circuits Announce Cooperation

EBV Elektronik, an Avnet company (Nasdaq: AVT), RoodMicrotec and Fraunhofer Institute for Integrated Circuits IIS announce their cooperation in the production and marketing of Fraunhofer IIS ready-to-use chip IP.
Since last year’s embedded world, EBV has been working on its EBVchips startup support platform. This tool enables EBV to support IC driven startups within the EBVchips program, and to offer marketing and sales services for new IC technologies. Partnering with Fraunhofer IIS, which is one of the world’s leading application-oriented research institutions for microelectronic and IT system solutions and services, will allow Fraunhofer IIS to use EBVchips as marketing and sales platform. This cooperation will be accomplished through a cooperation with RoodMicrotec, the leading independent European company for Semiconductor Supply and Quality Services, which will perform turnkey manufacturing services for the EBVchips.
“We are very delighted about this cooperation between EBV Elektronik, RoodMicrotec and Fraunhofer IIS. Startups in the IC technology area will have the opportunity to benefit from the expertise and knowledge of these three companies in this high-growth sector,” said Frank-Steffen Russ, Director Vertical Markets at EBV Elektronik.
With the news of this cooperation, two new EBVchips are being announced:

  • RFicient® Basic, Ultra-Low-Power WakeUp Receiver - this IC solution will enable customers to optimize the power consumption for various IoT applications thereby increasing battery lifetime dramatically.  
  • s-net® – this module solution is based on ST Micro’s ‘Spirit’ RF transceiver (S-NET-MOD-868-AM1) and enables customer to build extreme low power nodes in IoT Mesh networks.

www.ebv.com



Photo (from left to right): Juergen Hupp (Fraunhofer IIS, Head of Communication Networks Department) / Slobodan Puljarevic (EBV Elektronik, President) / Josef Sauerer (Fraunhofer IIS, Head of Division Smart Sensing and Electronics) / Reinhard Pusch (RoodMicrotec GmbH, COO) (EBV)